As semiconductor technology continues to miniaturize and become more complex, the requirements for wet processing applications in the semiconductor industry have become increasingly stringent. Different types of media are required to meet the diverse needs of various processes, such as semiconductor manufacturing, photovoltaics, and LED production. Therefore, providing highly clean, safe, and reliable fluid handling solutions and maintaining an ultra-high vacuum environment for critical process media is crucial.

Supermag® offers ultra-clean maglev wafer rotation systems, pump systems, and turbomolecular pumps. Our high-quality magnetic levitation equipment and technical support are designed to meet the stringent demands of advanced chip manufacturing processes, ensuring optimal performance and reliability.

Process Flow

Coating And Developing

In the coating and developing process, the Supermag® SCM Maglev Wafer Rotation System provides stable speed and acceleration for the spin coating of photoresist, ensuring a more precise coating process.

Rapid Thermal Processing (RTP)

In the RTP (Rapid Thermal Processing) process, the Supermag® SCM Maglev Wafer Rotation System perfectly addresses the vacuum chamber sealing issues and eliminates friction particles, ensuring high process yields.

Wet Etching

In the etching process, the Supermag® SCP Maglev Pump System provides a stable flow of etching solution, enhancing the controllability and uniformity of the etching process.

Dry Etching

The Supermag® SCT Maglev Turbomolecular Pump operates without oil and friction, providing an ultra-clean, high-vacuum environment. This minimizes the influence of contaminants on reactions, allowing for better control and improved etching quality.

Ion Implantation

In the ion implantation process, impurities in the air can damage the ion implanter, necessitating a high-vacuum environment. The Supermag® SCT Maglev Turbomolecular Pump offers excellent sealing, high vacuum, highly clean conditions, and fast pumping speeds. These features ensure the cleanliness and stability required during the ion implantation production process.

Thin Film Deposition

The Supermag® SCT Maglev Turbomolecular Pump eliminates the oil and gas contamination issues associated with mechanical bearings using conventional technology. With no mechanical friction, it achieves highly clean, high-vacuum environments, resulting in s

Wet Cleaning

At the single-wafer cleaning stage, the Supermag® SCM Maglev Wafer Rotation System completely eliminates the need for dynamic sealing of the chamber. Its hollow rotor design facilitates easy layout, significantly optimizing the single-wafer chamber design. Ultra-clean conditions are essential for the single-wafer cleaning process.
The Supermag® SCP Maglev Pump System provides ultra-clean and stable flow of cleaning solutions, ensuring optimal cleaning performance.

Electroplating

In the electroplating process, the Supermag® SCP Maglev Pump System, provides a stable flow of electrolyte, ensuring uniformity in the electroplating process.

Chemical Mechanical Planarization (CMP)

During CMP (Chemical Mechanical Planarization) slurry delivery, pumps using conventional technology with high shear forces can generate particles, leading to scratches. The Supermag® SCP Maglev Pump System provides a stable flow of polishing slurry for wafer grinding and polishing, with low shear force and significant anti-crystallization effects.

Applications

Coating And Developing

In the coating and developing process, the Supermag^® SCM Maglev Wafer Rotation System provides stable speed and acceleration for the spin coating of photoresist, ensuring a more precise coating process.

In the coating and developing process, the Supermag^® SCP Maglev Pump System delivers photoresist, developer, and other chemicals in the most clean, precise, and reliable manner.

Rapid Thermal Processing (RTP)

In the RTP (Rapid Thermal Processing) process, the Supermag^® SCM Maglev Wafer Rotation System perfectly addresses the vacuum chamber sealing issues and eliminates friction particles, ensuring high process yields.

Wet Etching

In the etching process, the Supermag^® SCP Maglev Pump System provides a stable flow of etching solution, enhancing the controllability and uniformity of the etching process.

Dry Etching

The Supermag^® SCT Maglev Turbomolecular Pump operates without oil and friction, providing an ultra-clean, high-vacuum environment. This minimizes the influence of contaminants on reactions, allowing for better control and improved etching quality.

Ion Implantation

In the ion implantation process, impurities in the air can damage the ion implanter, necessitating a high vacuum environment. The Supermag^® SCT Maglev Turbomolecular Pump offers excellent sealing, high vacuum, ultra-clean conditions, and fast pumping speeds. These features ensure the cleanliness and stability required during the ion implantation production process.

Thin Film Deposition

The Supermag^® SCT Maglev Turbomolecular Pump eliminates the oil and gas contamination issues associated with mechanical bearings using conventional technology. With no mechanical friction, it achieves highly clean, high-vacuum environments, resulting in smoother film surfaces and improved film quality and performance.

Wet Cleaning

At the single-wafer cleaning stage, the Supermag^® SCM Maglev Wafer Rotation completely eliminates the need for dynamic sealing of the chamber. Its hollow rotor design facilitates easy layout, significantly optimizing the single-wafer chamber design.

Ultra-clean conditions are essential for the single-wafer cleaning process. The Supermag^® SCP Maglev Pump System provides ultra-clean and stable flow of cleaning solutions, ensuring optimal cleaning performance.

Electroplating

In the electroplating process, the Supermag^® SCP Maglev Pump System, provides a stable flow of electrolyte, ensuring uniformity in the electroplating process.

Chemical Mechanical Planarization (CMP)

During CMP (Chemical Mechanical Planarization) slurry delivery, pumps using conventional technology with high shear forces can generate particles, leading to scratches. The Supermag^® SCP Maglev Pump System provides a stable flow of polishing slurry for wafer grinding and polishing, with low shear force and significant anti-crystallization effects.